Factory Lead Time  

10 Weeks

Contact Plating  

Tin

Mount  

Surface Mount

Mounting Type  

Surface Mount

Package / Case  

DO-214AC, SMA

Number of Pins  

2

Diode Element Material  

SILICON

Operating Temperature (Max)  

150°C

Operating Temperature (Min)  

-55°C

Number of Elements  

1

Power Dissipation (Max)  

1.47W

Packaging  

Tape & Reel (TR)

Published  

2006

JESD-609 Code  

e3

Pbfree Code  

yes

Part Status  

ACTIVE (Last Updated: 2 days ago)

Moisture Sensitivity Level (MSL)  

1 (Unlimited)

Number of Terminations  

2

Termination  

SMD/SMT

ECCN Code  

EAR99

HTS Code  

8541.10.00.80

Terminal Position  

DUAL

Terminal Form  

C BEND

Base Part Number  

ES1F

Voltage  

300V

Element Configuration  

Single

Speed  

Fast Recovery =< 500ns, > 200mA (Io)

Current  

1A

Diode Type  

Standard

Current - Reverse Leakage @ Vr  

5μA @ 300V

Voltage - Forward (Vf) (Max) @ If  

1.3V @ 1A

Forward Current  

1A

Operating Temperature - Junction  

150°C Max

Max Surge Current  

30A

Forward Voltage  

1.3V

Max Reverse Voltage (DC)  

300V

Average Rectified Current  

1A

Reverse Recovery Time  

35 ns

Peak Reverse Current  

5μA

Max Repetitive Reverse Voltage (Vrrm)  

300V

Capacitance @ Vr, F  

10pF @ 4V 1MHz

Peak Non-Repetitive Surge Current  

30A

Reverse Voltage  

300V

Max Forward Surge Current (Ifsm)  

30A

Recovery Time  

35 ns

Height  

2.235mm

Length  

4.6mm

Width  

2.896mm

REACH SVHC  

No SVHC

Radiation Hardening  

No

RoHS Status  

ROHS3 Compliant

Lead Free  

Lead Free